KOH YOUNG ASPIRE 2 3D SOLDER PASTE INSPECTION MACHINE

THE KOH YOUNG ASPIRE 2 3D SOLDER PASTE INSPECTION MACHINE IS A PCB ASSEMBLY SYSTEM ENGINEERED FOR COMPREHENSIVE THREE-DIMENSIONAL ANALYSIS OF SOLDER PASTE DEPOSITS. IT OPERATES ON 220 VAC, SINGLE-PHASE POWER. UTILIZING PATENTED 3D MOIRÉ TECHNOLOGY, THE SYSTEM PERFORMS FULL 3D MEASUREMENT TO QUANTIFY CRITICAL PARAMETERS INCLUDING SOLDER PASTE VOLUME, AREA, HEIGHT, OFFSET, AND BRIDGE DEFECTS. THE ASPIRE 2 3D FEATURES A 15ΜM MEASUREMENT RESOLUTION, ENABLING PRECISE INSPECTION FOR QUALITY CONTROL IN SURFACE MOUNT TECHNOLOGY PROCESSES. IT ACCOMMODATES PRINTED CIRCUIT BOARDS RANGING FROM A MINIMUM OF 50 X 50 MM TO A MAXIMUM OF 510 X 510 MM, FACILITATING ROBUST PRE-REFLOW INSPECTION WITHIN PRODUCTION LINES.