KOH YOUNG ASPIRE 2 3D SOLDER PASTE INSPECTION MACHINE

THE KOH YOUNG ASPIRE2 3D IS A SOLDER PASTE INSPECTION (SPI) MACHINE DESIGNED FOR PCB ASSEMBLY LINES, PROVIDING FULL 3D MEASUREMENT OF SOLDER PASTE DEPOSITS. UTILIZING SHADOW-FREE 8-WAY DIRECTIONAL PROJECTION WITH DUAL PROJECTION TECHNOLOGY, IT ACCURATELY INSPECTS CRITICAL PARAMETERS INCLUDING VOLUME, AREA, HEIGHT, X/Y OFFSET, SHAPE, AND BRIDGING. THE SYSTEM TYPICALLY OPERATES WITH A MEASUREMENT RESOLUTION OF 10 ΜM AND CAN ACHIEVE INSPECTION SPEEDS OF UP TO 60 CM²/SEC, SUPPORTING VARIOUS FIELD OF VIEW (FOV) OPTIONS. IT ACCOMMODATES PRINTED CIRCUIT BOARDS (PCBS) RANGING FROM A MINIMUM OF 50 X 50 MM TO A MAXIMUM OF 510 X 510 MM. FOR SEAMLESS INTEGRATION INTO PRODUCTION LINES, THE ASPIRE2 3D IS SMEMA COMPATIBLE. ELECTRICAL POWER REQUIREMENTS ARE 220 VAC, SINGLE-PHASE.