AMERA SEIKI S-50 HORIZONTAL MACHINING CENTER

Equipment Overview
Share Link- OEM
- AMERA SEIKI
- Model
- S-50
- Year of Manufacture
- -
- Category
- HORIZONTAL MACHINING CENTERS
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A+Technical Description
The AMERA SEIKI S-50 Horizontal Machining Center is engineered for turning and milling tasks with a robust main spindle capable of handling large workpieces. It supports a **maximum turning diameter of 38.19 inches** and a **turning length of up to 78 inches**, with a substantial **spindle chuck diameter of 21 inches** and a maximum spindle swing of 50.19 inches. The spindle accommodates bar diameters up to 6.5 inches. This center features a single main spindle rated at 500 RPM and powered by a 50 HP motor, optimized for heavy-duty machining operations. The machine uses a turret-style primary tool carrier with a **maximum capacity of 12 tools in both turning and rotary configurations**, although it supports only one simultaneous cutting tool at a time. It operates on a **2-axis configuration** with travel distances of 26.06 inches along the X-axis and 78.7 inches along the Z-axis, both featuring rapid traverse rates of 590 inches per minute for efficient material removal. The Y-axis rapid traverse matches this speed at 590 ipm, facilitating quick positioning and cycle times. Designed for large-scale turning applications, the S-50 combines powerful spindle specifications with precise turret tooling and substantial travel ranges, making it suitable for machining sizable components requiring high rigidity and power. Its moderate spindle speed, high horsepower, and large tool capacity optimize it for turning operations demanding both torque and reach.
Technical Attributes
- Spindle Power
- 50.00 HP
- X-Axis Travel
- 26.06 ''
- # of Axes
- 2.00
- Z-Axis Travel
- 78.70 ''
- Max Spindle Speed
- 500.00 RPM
Data Accuracy and Verification
Specifications and technical details are compiled from manufacturer documentation, historical records, and third-party industry sources. While care is taken to ensure accuracy, this information is provided for reference purposes only and may contain errors or omissions. Users should independently verify all details before relying on them.
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