SMEC CO., LTD PL 800GB HORIZONTAL MACHINING CENTER

Technical Description

The SMEC PL 800GB is a 2-axis CNC turning center engineered for precision grinding and turning operations in semiconductor and specialty materials manufacturing. Featuring a 12-inch chuck with an 800mm swing over bed (31-inch max swing), this machine delivers high rigidity and ultra-precision capabilities essential for quartz and ceramic grinding applications. The primary spindle operates at 200 RPM with a 15 kW continuous motor (20 kW maximum), providing substantial torque for heavy-duty grinding operations. X and Z-axis travels of 400mm each accommodate workpieces up to 600mm diameter with 150mm length, while rapid traverse rates reach 16 m/min on the X-axis and 24 m/min on the Z-axis. The machine employs box guideway construction on the X-axis with roller linear motion guideway on the Z-axis, ensuring superior stability and repeatability. A belt-type grinding spindle with independent 6,000 RPM capability and 3.7 kW motor handles specialized grinding tasks, complementing the main spindle's turning functions. The architecture supports single-point tool engagement with servo-driven turret positioning for rapid tool changes. Controlled by Fanuc Oi-Mate TD CNC, the system integrates advanced automation for consistent precision. Weighing 3,600 kgf and requiring 2,100mm × 1,745mm floor space, the PL 800GB combines compact footprint with substantial capacity, making it ideal for semiconductor component finishing, quartz crystal grinding, and precision ceramic machining operations requiring exceptional surface quality and dimensional accuracy.