KOH YOUNG ASPIRE 2 3D, PCB ASSEMBLY, 1 ΜM Z RES, 10X10 ΜM XY RES, 510X510 MM MAX PCB
Aucto ID: #98420
Ends in:
55b06cb7-dcb1-435b-b3cc-94e0d7b708fa
Location: El Paso, Texas, United States
Logistics:
Rigging:
Not Required
Loading:
Included
Shipping:
Buyer
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FAQsVerified Seller: OCO Industrial
3106Selling since 2026.
Product Description
THE KOH YOUNG ASPIRE 2 3D IS A HIGH-PRECISION 3D SOLDER PASTE INSPECTION (SPI) MACHINE DESIGNED FOR PCB ASSEMBLY PROCESSES. IT EMPLOYS TRUE 3D PROFILOMETRY MEASUREMENT TECHNOLOGY TO INSPECT SOLDER PASTE CHARACTERISTICS INCLUDING VOLUME, AREA, HEIGHT, X/Y OFFSET, BRIDGE, AND SHAPE DEFORMATION. THE SYSTEM OFFERS A HEIGHT MEASUREMENT REPEATABILITY OF LESS THAN 1 ΜM (2 SIGMA) AND Z-AXIS RESOLUTION OF 1 ΜM. IT FEATURES AN XY RESOLUTION OF 10X10 ΜM OR 15X15 ΜM, AND CAN INSPECT PCBS RANGING FROM 50X50 MM UP TO 510X510 MM, WITH A MAXIMUM THICKNESS OF 5 MM. POWER REQUIREMENTS ARE 220 VAC, SINGLE-PHASE, 50/60 HZ, AND IT IS SMEMA COMPATIBLE FOR INLINE INTEGRATION.
Core Specifications
Manufacturer: KOH YOUNG
Model: 2 3D
Condition: Good
- Item functions as originally intended, shows minimal signs of wear.Category:
PROCESS EQUIPMENT > INSPECTION & MEASUREMENT > VISUAL INSPECTIONLogistics
Rigging Responsibility:
Not Required
Loading Responsibility:
Included
Shipping Responsibility:
Buyer
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