Koh Young Aspire 2 3D, PCB Assembly, 1 ΜM Z Res, 10X10 ΜM Xy Res, 510X510 mm Max PCB

The Koh Young Aspire 2 3D is a high-precision 3D Solder Paste Inspection (SPI) machine designed for PCB assembly processes. It employs true 3D profilometry measurement technology to inspect solder paste characteristics including volume, area, height, X/Y offset, bridge, and shape deformation. The system offers a height measurement repeatability of less than 1 ΜM (2 sigma) and Z-axis resolution of 1 ΜM. It features an XY resolution of 10x10 ΜM or 15x15 ΜM, and can inspect PCBs ranging from 50x50 mm up to 510x510 mm, with a maximum thickness of 5 mm. Power requirements are 220 VAC, single-phase, 50/60 Hz, and it is SMEMA compatible for inline integration.