Koh Young Aspire 2 3D, PCB Assembly, 510X510 mm Max PCB, 680 kg Weight, 220V Power

THE KOH YOUNG ASPIRE 2 3D IS A SOLDER PASTE INSPECTION MACHINE ENGINEERED FOR PCB ASSEMBLY APPLICATIONS. IT UTILIZES SHADOW-FREE MOIRÉ FRINGE PROJECTION TECHNOLOGY TO ACHIEVE TRUE 3D PROFILOMETRIC MEASUREMENTS OF SOLDER PASTE DEPOSITS. THE SYSTEM INSPECTS CRITICAL PARAMETERS SUCH AS SOLDER PASTE VOLUME, AREA, HEIGHT, X/Y OFFSET, AND DETECTS ANOMALIES INCLUDING BRIDGING AND SHAPE DEVIATIONS. IT OPERATES ON A 220 VAC, SINGLE-PHASE POWER SUPPLY. TYPICAL MEASUREMENT SPECIFICATIONS INCLUDE A VOLUME ACCURACY OF LESS THAN 1% (3Σ) AND A HEIGHT ACCURACY OF LESS THAN 2 MICROMETERS (3Σ). THE MACHINE IS CAPABLE OF INSPECTING PCBS WITH A MAXIMUM SIZE OF 510 X 510 MM AND A MINIMUM SIZE OF 50 X 50 MM. ITS APPROXIMATE DIMENSIONS ARE 980 MM (L) X 1475 MM (W) X 1560 MM (H), WITH AN APPROXIMATE WEIGHT OF 680 KG. IT COMMONLY PROVIDES SELECTABLE MEASUREMENT RESOLUTIONS, SUCH AS 10 ΜM OR 15 ΜM, AND ACHIEVES INSPECTION SPEEDS AROUND 0.65 SECONDS PER FIELD OF VIEW.