2020 DMG MORI SEIKI DMU70 VERTICAL MACHINING CENTER

DMG MORI SEIKI DMU70 2020 DMG MORI SEIKI DMU70 VERTICAL MACHINING CENTER equipment image

Equipment Overview

Share Link
OEM
DMG MORI SEIKI
Model
DMU70
Year of Manufacture
2020
Category
VERTICAL MACHINING CENTERS

Market Value Calculator

A+

Technical Description

The 2020 DMG MORI SEIKI DMU70 is a 5-axis vertical machining center designed for high-precision milling and contouring operations. The machine features a work table measuring 19.69 x 19.69 inches, providing ample fixturing area for a wide range of workpiece sizes. Axis travels measure 29.53 inches in X, 23.62 inches in Y, and 20.47 inches in Z, enabling a versatile machining envelope suitable for a broad range of component sizes. The spindle delivers 33.5 HP of continuous power at speeds up to 18,000 RPM, supporting cutting strategies from heavy roughing through fine finishing. Machine motion is governed by the Heidenhain iTNC 530 CNC control system, providing operators with advanced programming capabilities and intuitive operation. Full 5-axis simultaneous capability allows the DMU70 to machine complex contoured surfaces and undercuts in a single setup, reducing part handling and improving geometric accuracy. The machine weighs approximately 19,842 lbs, reflecting the robust cast iron construction that contributes to vibration damping and long-term dimensional stability.

Technical Attributes

Spindle Power
33.5 HP
Max Spindle Speed
18000 RPM
Z-Axis Travel
20.47 ''
Control System
Heidenhain iTNC 530
X-Axis Travel
29.53 ''
Table Size (LxW)
19.69 x 19.69
Y-Axis Travel
23.62 ''
# of Axes
5

Data Accuracy and Verification

Specifications and technical details are compiled from manufacturer documentation, historical records, and third-party industry sources. While care is taken to ensure accuracy, this information is provided for reference purposes only and may contain errors or omissions. Users should independently verify all details before relying on them.

If you identify any inaccuracies, please help us improve our data by reporting them here.