2008 DMG MORI SEIKI HSC55 LINEAR VERTICAL MACHINING CENTER

DMG MORI SEIKI HSC55 LINEAR 2008 DMG MORI SEIKI HSC55 LINEAR VERTICAL MACHINING CENTER equipment image

Equipment Overview

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OEM
DMG MORI SEIKI
Model
HSC55 LINEAR
Year of Manufacture
2008
Category
VERTICAL MACHINING CENTERS

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Technical Description

The 2008 DMG MORI SEIKI HSC55 LINEAR is a 5-axis vertical machining center designed for high-precision milling and contouring operations. The machine features a work table measuring 15.75 x 15.75 inches, providing ample fixturing area for a wide range of workpiece sizes. Axis travels measure 17.72 inches in X, 22.83 inches in Y, and 15.75 inches in Z, enabling a versatile machining envelope suitable for a broad range of component sizes. The spindle delivers 29.5 HP of continuous power at speeds up to 28,000 RPM, supporting cutting strategies from heavy roughing through fine finishing. Machine motion is governed by the Heidenhain iTNC 530 CNC control system, providing operators with advanced programming capabilities and intuitive operation. Full 5-axis simultaneous capability allows the HSC55 LINEAR to machine complex contoured surfaces and undercuts in a single setup, reducing part handling and improving geometric accuracy. The machine weighs approximately 20,944 lbs, reflecting the robust cast iron construction that contributes to vibration damping and long-term dimensional stability. This high-speed machining center employs linear direct drives on all axes, delivering exceptional dynamic response and thermal stability suited to die/mold and aerospace applications.

Technical Attributes

Table Size (LxW)
15.75 x 15.75
Control System
Heidenhain iTNC 530
# of Axes
5
Max Spindle Speed
28000 RPM
X-Axis Travel
17.72 ''
Y-Axis Travel
22.83 ''
Z-Axis Travel
15.75 ''
Spindle Power
29.5 HP

Data Accuracy and Verification

Specifications and technical details are compiled from manufacturer documentation, historical records, and third-party industry sources. While care is taken to ensure accuracy, this information is provided for reference purposes only and may contain errors or omissions. Users should independently verify all details before relying on them.

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