2010 DMG MORI SEIKI HSC75 LINEAR VERTICAL MACHINING CENTER

DMG MORI SEIKI HSC75 LINEAR 2010 DMG MORI SEIKI HSC75 LINEAR VERTICAL MACHINING CENTER equipment image

Equipment Overview

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OEM
DMG MORI SEIKI
Model
HSC75 LINEAR
Year of Manufacture
2010
Category
VERTICAL MACHINING CENTERS

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Technical Description

The 2010 DMG MORI SEIKI HSC75 LINEAR is a 5-axis vertical machining center designed for high-precision milling and contouring operations. The machine features a work table measuring ΓΈ27.56 (rotary) inches, providing ample fixturing area for a wide range of workpiece sizes. Axis travels measure 29.53 inches in X, 23.62 inches in Y, and 22.05 inches in Z, enabling a versatile machining envelope suitable for a broad range of component sizes. The spindle delivers 40.2 HP of continuous power at speeds up to 18,000 RPM, supporting cutting strategies from heavy roughing through fine finishing. Machine motion is governed by the Heidenhain iTNC 530 CNC control system, providing operators with advanced programming capabilities and intuitive operation. Full 5-axis simultaneous capability allows the HSC75 LINEAR to machine complex contoured surfaces and undercuts in a single setup, reducing part handling and improving geometric accuracy. The machine weighs approximately 22,046 lbs, reflecting the robust cast iron construction that contributes to vibration damping and long-term dimensional stability. Linear direct drives on all axes enable rapid traverse and acceleration rates well beyond conventional ballscrew designs, making this machine highly productive for high-speed die/mold and aerospace machining.

Technical Attributes

Z-Axis Travel
22.05 ''
Y-Axis Travel
23.62 ''
# of Axes
5
Max Spindle Speed
18000 RPM
X-Axis Travel
29.53 ''
Spindle Power
40.2 HP
Control System
Heidenhain iTNC 530

Data Accuracy and Verification

Specifications and technical details are compiled from manufacturer documentation, historical records, and third-party industry sources. While care is taken to ensure accuracy, this information is provided for reference purposes only and may contain errors or omissions. Users should independently verify all details before relying on them.

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